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Qualcomm:
>> Sd460 Firmware
Security Vulnerabilities
CVE-2025-21449
Transient DOS may occur while processing malformed length field in SSID IEs.
CVSS Score
7.5
EPSS Score
0.001
Published
2025-07-08
CVE-2025-21454
Transient DOS while processing received beacon frame.
CVSS Score
7.5
EPSS Score
0.001
Published
2025-07-08
CVE-2024-43046
There may be information disclosure during memory re-allocation in TZ Secure OS.
CVSS Score
5.5
EPSS Score
0.0
Published
2025-04-07
CVE-2024-43051
Information disclosure while deriving keys for a session for any Widevine use case.
CVSS Score
5.5
EPSS Score
0.0
Published
2025-03-03
CVE-2024-33056
Memory corruption when allocating and accessing an entry in an SMEM partition continuously.
CVSS Score
8.4
EPSS Score
0.0
Published
2024-12-02
CVE-2024-33051
Transient DOS while processing TIM IE from beacon frame as there is no check for IE length.
CVSS Score
7.5
EPSS Score
0.002
Published
2024-09-02
CVE-2024-23362
Cryptographic issue while parsing RSA keys in COBR format.
CVSS Score
7.1
EPSS Score
0.002
Published
2024-09-02
CVE-2024-33016
memory corruption when an invalid firehose patch command is invoked.
CVSS Score
6.8
EPSS Score
0.001
Published
2024-09-02
CVE-2024-21469
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.
CVSS Score
7.3
EPSS Score
0.001
Published
2024-07-01
CVE-2024-21461
Memory corruption while performing finish HMAC operation when context is freed by keymaster.
CVSS Score
8.4
EPSS Score
0.001
Published
2024-07-01
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