Qualcomm: >> Sm7315 Firmware Security Vulnerabilities
Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.
CVSS Score
7.5
EPSS Score
0.001
Published
2024-02-06
Transient DOS in Multi-Mode Call Processor while processing UE policy container.
CVSS Score
7.5
EPSS Score
0.001
Published
2024-02-06
Information disclosure in Audio while accessing AVCS services from ADSP payload.
CVSS Score
6.1
EPSS Score
0.0
Published
2024-02-06
Transient DOS while parsing IPv6 extension header when WLAN firmware receives an IPv6 packet that contains `IPPROTO_NONE` as the next header.
CVSS Score
7.5
EPSS Score
0.004
Published
2024-01-02
Memory corruption when resource manager sends the host kernel a reply message with multiple fragments.
CVSS Score
8.4
EPSS Score
0.001
Published
2024-01-02
Memory corruption when HLOS allocates the response payload buffer to copy the data received from ADSP in response to AVCS_LOAD_MODULE command.
CVSS Score
7.8
EPSS Score
0.001
Published
2024-01-02
Memory corruption while processing Listen Sound Model client payload buffer when there is a request for Listen Sound session get parameter from ST HAL.
CVSS Score
7.8
EPSS Score
0.001
Published
2024-01-02
Memory corruption in Audio when memory map command is executed consecutively in ADSP.
CVSS Score
7.8
EPSS Score
0.001
Published
2024-01-02
Memory corruption while running VK synchronization with KASAN enabled.
CVSS Score
8.4
EPSS Score
0.001
Published
2024-01-02
Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host.
CVSS Score
7.5
EPSS Score
0.002
Published
2024-01-02