Qualcomm: >> Snapdragon 460 Mobile Platform Firmware Security Vulnerabilities
Memory corruption while processing graphics kernel driver request to create DMA fence.
CVSS Score
8.4
EPSS Score
0.0
Published
2024-08-05
Transient DOS while decoding attach reject message received by UE, when IEI is set to ESM_IEI.
CVSS Score
7.5
EPSS Score
0.001
Published
2024-08-05
Memory corruption when keymaster operation imports a shared key.
CVSS Score
7.8
EPSS Score
0.0
Published
2024-08-05
Memory corruption during session sign renewal request calls in HLOS.
CVSS Score
7.8
EPSS Score
0.0
Published
2024-08-05
Memory corruption while invoking IOCTL call for GPU memory allocation and size param is greater than expected size.
CVSS Score
8.4
EPSS Score
0.0
Published
2024-07-01
Memory corruption when IOMMU unmap operation fails, the DMA and anon buffers are getting released.
CVSS Score
8.4
EPSS Score
0.0
Published
2024-07-01
Memory corruption while handling user packets during VBO bind operation.
CVSS Score
8.4
EPSS Score
0.0
Published
2024-07-01
Memory corruption when an invoke call and a TEE call are bound for the same trusted application.
CVSS Score
7.3
EPSS Score
0.0
Published
2024-07-01
Memory corruption when allocating and accessing an entry in an SMEM partition.
CVSS Score
7.8
EPSS Score
0.0
Published
2024-07-01
Memory corruption while performing finish HMAC operation when context is freed by keymaster.
CVSS Score
8.4
EPSS Score
0.0
Published
2024-07-01