Vulnerability Details CVE-2022-25698
Memory corruption in SPI buses due to improper input validation while reading address configuration from spi buses in Snapdragon Mobile, Snapdragon Wearables
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 13.3%
CVSS Severity
CVSS v3 Score 8.4
References
Products affected by CVE-2022-25698
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cpe:2.3:h:qualcomm:sd429:-
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cpe:2.3:h:qualcomm:sda429w:-
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cpe:2.3:h:qualcomm:sdm429w:-
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cpe:2.3:h:qualcomm:sm8475:-
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cpe:2.3:h:qualcomm:wcd9380:-
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cpe:2.3:h:qualcomm:wcn3610:-
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cpe:2.3:h:qualcomm:wcn3620:-
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cpe:2.3:h:qualcomm:wcn3660b:-
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cpe:2.3:h:qualcomm:wcn3680b:-
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cpe:2.3:h:qualcomm:wcn3980:-
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cpe:2.3:h:qualcomm:wcn6855:-
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cpe:2.3:h:qualcomm:wcn6856:-
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cpe:2.3:h:qualcomm:wcn7850:-
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cpe:2.3:h:qualcomm:wcn7851:-
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cpe:2.3:h:qualcomm:wsa8830:-
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cpe:2.3:h:qualcomm:wsa8835:-
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cpe:2.3:o:qualcomm:sd429_firmware:-
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cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-
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cpe:2.3:o:qualcomm:sda429w_firmware:-
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cpe:2.3:o:qualcomm:sdm429w_firmware:-
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cpe:2.3:o:qualcomm:wcd9380_firmware:-
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cpe:2.3:o:qualcomm:wcn3610_firmware:-
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cpe:2.3:o:qualcomm:wcn3620_firmware:-
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cpe:2.3:o:qualcomm:wcn3660b_firmware:-
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cpe:2.3:o:qualcomm:wcn3680b_firmware:-
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cpe:2.3:o:qualcomm:wcn3980_firmware:-
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cpe:2.3:o:qualcomm:wcn6855_firmware:-
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cpe:2.3:o:qualcomm:wcn6856_firmware:-
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cpe:2.3:o:qualcomm:wcn7850_firmware:-
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cpe:2.3:o:qualcomm:wcn7851_firmware:-
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cpe:2.3:o:qualcomm:wsa8830_firmware:-
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cpe:2.3:o:qualcomm:wsa8835_firmware:-