Vulnerability Details CVE-2022-25697
Memory corruption in i2c buses due to improper input validation while reading address configuration from i2c driver in Snapdragon Mobile, Snapdragon Wearables
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 16.4%
CVSS Severity
CVSS v3 Score 8.4
References
Products affected by CVE-2022-25697
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cpe:2.3:h:qualcomm:sd429:-
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cpe:2.3:h:qualcomm:sda429w:-
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cpe:2.3:h:qualcomm:sdm429w:-
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cpe:2.3:h:qualcomm:sm8475:-
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cpe:2.3:h:qualcomm:wcd9380:-
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cpe:2.3:h:qualcomm:wcn3610:-
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cpe:2.3:h:qualcomm:wcn3620:-
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cpe:2.3:h:qualcomm:wcn3660b:-
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cpe:2.3:h:qualcomm:wcn3680b:-
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cpe:2.3:h:qualcomm:wcn3980:-
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cpe:2.3:h:qualcomm:wcn6855:-
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cpe:2.3:h:qualcomm:wcn6856:-
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cpe:2.3:h:qualcomm:wcn7850:-
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cpe:2.3:h:qualcomm:wcn7851:-
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cpe:2.3:h:qualcomm:wsa8830:-
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cpe:2.3:h:qualcomm:wsa8835:-
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cpe:2.3:o:qualcomm:sd429_firmware:-
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cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-
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cpe:2.3:o:qualcomm:sda429w_firmware:-
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cpe:2.3:o:qualcomm:sdm429w_firmware:-
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cpe:2.3:o:qualcomm:wcd9380_firmware:-
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cpe:2.3:o:qualcomm:wcn3610_firmware:-
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cpe:2.3:o:qualcomm:wcn3620_firmware:-
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cpe:2.3:o:qualcomm:wcn3660b_firmware:-
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cpe:2.3:o:qualcomm:wcn3680b_firmware:-
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cpe:2.3:o:qualcomm:wcn3980_firmware:-
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cpe:2.3:o:qualcomm:wcn6855_firmware:-
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cpe:2.3:o:qualcomm:wcn6856_firmware:-
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cpe:2.3:o:qualcomm:wcn7850_firmware:-
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cpe:2.3:o:qualcomm:wcn7851_firmware:-
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cpe:2.3:o:qualcomm:wsa8830_firmware:-
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cpe:2.3:o:qualcomm:wsa8835_firmware:-