Vulnerability Details CVE-2022-25697
Memory corruption in i2c buses due to improper input validation while reading address configuration from i2c driver in Snapdragon Mobile, Snapdragon Wearables
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 13.3%
CVSS Severity
CVSS v3 Score 8.4
References
Products affected by CVE-2022-25697
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cpe:2.3:h:qualcomm:sd429:-
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cpe:2.3:h:qualcomm:sda429w:-
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cpe:2.3:h:qualcomm:sdm429w:-
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cpe:2.3:h:qualcomm:sm8475:-
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cpe:2.3:h:qualcomm:wcd9380:-
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cpe:2.3:h:qualcomm:wcn3610:-
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cpe:2.3:h:qualcomm:wcn3620:-
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cpe:2.3:h:qualcomm:wcn3660b:-
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cpe:2.3:h:qualcomm:wcn3680b:-
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cpe:2.3:h:qualcomm:wcn3980:-
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cpe:2.3:h:qualcomm:wcn6855:-
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cpe:2.3:h:qualcomm:wcn6856:-
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cpe:2.3:h:qualcomm:wcn7850:-
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cpe:2.3:h:qualcomm:wcn7851:-
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cpe:2.3:h:qualcomm:wsa8830:-
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cpe:2.3:h:qualcomm:wsa8835:-
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cpe:2.3:o:qualcomm:sd429_firmware:-
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cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-
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cpe:2.3:o:qualcomm:sda429w_firmware:-
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cpe:2.3:o:qualcomm:sdm429w_firmware:-
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cpe:2.3:o:qualcomm:wcd9380_firmware:-
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cpe:2.3:o:qualcomm:wcn3610_firmware:-
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cpe:2.3:o:qualcomm:wcn3620_firmware:-
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cpe:2.3:o:qualcomm:wcn3660b_firmware:-
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cpe:2.3:o:qualcomm:wcn3680b_firmware:-
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cpe:2.3:o:qualcomm:wcn3980_firmware:-
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cpe:2.3:o:qualcomm:wcn6855_firmware:-
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cpe:2.3:o:qualcomm:wcn6856_firmware:-
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cpe:2.3:o:qualcomm:wcn7850_firmware:-
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cpe:2.3:o:qualcomm:wcn7851_firmware:-
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cpe:2.3:o:qualcomm:wsa8830_firmware:-
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cpe:2.3:o:qualcomm:wsa8835_firmware:-