Vulnerability Details CVE-2022-25334
The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 14.9%
CVSS Severity
CVSS v3 Score 8.2
References
Products affected by CVE-2022-25334
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cpe:2.3:h:ti:omap_l138:-
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cpe:2.3:o:ti:omap_l138_firmware:-