Vulnerability Details CVE-2022-22090
Memory corruption in audio due to use after free while managing buffers from internal cache in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 21.7%
CVSS Severity
CVSS v3 Score 8.4
CVSS v2 Score 7.2
Products affected by CVE-2022-22090
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cpe:2.3:h:qualcomm:sd865_5g:-
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cpe:2.3:h:qualcomm:sd888_5g:-
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cpe:2.3:h:qualcomm:sdx65:-
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cpe:2.3:h:qualcomm:sm7450:-
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cpe:2.3:h:qualcomm:sm8475:-
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cpe:2.3:h:qualcomm:sm8475p:-
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cpe:2.3:h:qualcomm:wcd9370:-
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cpe:2.3:h:qualcomm:wcd9375:-
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cpe:2.3:h:qualcomm:wcd9380:-
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cpe:2.3:h:qualcomm:wcd9385:-
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cpe:2.3:h:qualcomm:wcn6750:-
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cpe:2.3:h:qualcomm:wcn6850:-
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cpe:2.3:h:qualcomm:wcn6851:-
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cpe:2.3:h:qualcomm:wcn6855:-
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cpe:2.3:h:qualcomm:wcn6856:-
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cpe:2.3:h:qualcomm:wcn7850:-
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cpe:2.3:h:qualcomm:wcn7851:-
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cpe:2.3:h:qualcomm:wsa8810:-
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cpe:2.3:h:qualcomm:wsa8815:-
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cpe:2.3:h:qualcomm:wsa8830:-
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cpe:2.3:h:qualcomm:wsa8832:-
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cpe:2.3:h:qualcomm:wsa8835:-
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cpe:2.3:o:qualcomm:sd865_5g_firmware:-
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cpe:2.3:o:qualcomm:sd888_5g_firmware:-
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cpe:2.3:o:qualcomm:sd_8_gen1_5g_firmware:-
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cpe:2.3:o:qualcomm:sdx65_firmware:-
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cpe:2.3:o:qualcomm:sm7450_firmware:-
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cpe:2.3:o:qualcomm:sm8475_firmware:-
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cpe:2.3:o:qualcomm:sm8475p_firmware:-
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cpe:2.3:o:qualcomm:wcd9370_firmware:-
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cpe:2.3:o:qualcomm:wcd9375_firmware:-
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cpe:2.3:o:qualcomm:wcd9380_firmware:-
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cpe:2.3:o:qualcomm:wcd9385_firmware:-
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cpe:2.3:o:qualcomm:wcn6750_firmware:-
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cpe:2.3:o:qualcomm:wcn6850_firmware:-
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cpe:2.3:o:qualcomm:wcn6851_firmware:-
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cpe:2.3:o:qualcomm:wcn6855_firmware:-
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cpe:2.3:o:qualcomm:wcn6856_firmware:-
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cpe:2.3:o:qualcomm:wcn7850_firmware:-
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cpe:2.3:o:qualcomm:wcn7851_firmware:-
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cpe:2.3:o:qualcomm:wsa8810_firmware:-
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cpe:2.3:o:qualcomm:wsa8815_firmware:-
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cpe:2.3:o:qualcomm:wsa8830_firmware:-
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cpe:2.3:o:qualcomm:wsa8832_firmware:-
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cpe:2.3:o:qualcomm:wsa8835_firmware:-