Vulnerability Details CVE-2020-3617
u'Buffer over-read Issue in Q6 testbus framework due to diag packet length is not completely validated before accessing the field and leads to Information disclosure.' in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in Kamorta, Nicobar, QCS605, QCS610, Rennell, SC7180, SDA660, SDM630, SDM636, SDM660, SDM670, SDM710, SM6150, SM7150, SM8150, SXR1130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 8.1%
CVSS Severity
CVSS v3 Score 7.1
CVSS v2 Score 6.6
References
Products affected by CVE-2020-3617
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cpe:2.3:h:qualcomm:kamorta:-
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cpe:2.3:h:qualcomm:nicobar:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:qcs610:-
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cpe:2.3:h:qualcomm:rennell:-
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cpe:2.3:h:qualcomm:sc7180:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm636:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sdm670:-
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cpe:2.3:h:qualcomm:sdm710:-
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cpe:2.3:h:qualcomm:sm6150:-
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cpe:2.3:h:qualcomm:sm7150:-
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cpe:2.3:h:qualcomm:sm8150:-
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cpe:2.3:h:qualcomm:sxr1130:-
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cpe:2.3:o:qualcomm:kamorta_firmware:-
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cpe:2.3:o:qualcomm:nicobar_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:qcs610_firmware:-
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cpe:2.3:o:qualcomm:rennell_firmware:-
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cpe:2.3:o:qualcomm:sc7180_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm636_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sdm670_firmware:-
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cpe:2.3:o:qualcomm:sdm710_firmware:-
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cpe:2.3:o:qualcomm:sm6150_firmware:-
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cpe:2.3:o:qualcomm:sm7150_firmware:-
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cpe:2.3:o:qualcomm:sm8150_firmware:-
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cpe:2.3:o:qualcomm:sxr1130_firmware:-