Vulnerability Details CVE-2020-11169
u'Buffer over-read while processing received L2CAP packet due to lack of integer overflow check' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55
Exploit prediction scoring system (EPSS) score
EPSS Score 0.003
EPSS Ranking 51.7%
CVSS Severity
CVSS v3 Score 9.1
CVSS v2 Score 6.4
References
Products affected by CVE-2020-11169
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cpe:2.3:h:qualcomm:apq8009:-
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cpe:2.3:h:qualcomm:apq8053:-
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cpe:2.3:h:qualcomm:qca6390:-
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cpe:2.3:h:qualcomm:qcn7605:-
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cpe:2.3:h:qualcomm:qcn7606:-
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cpe:2.3:h:qualcomm:sa415m:-
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cpe:2.3:h:qualcomm:sa515m:-
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cpe:2.3:h:qualcomm:sa6155p:-
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cpe:2.3:h:qualcomm:sa8155p:-
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cpe:2.3:h:qualcomm:sc8180x:-
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cpe:2.3:h:qualcomm:sdx55:-
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cpe:2.3:o:qualcomm:apq8009_firmware:-
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cpe:2.3:o:qualcomm:apq8053_firmware:-
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cpe:2.3:o:qualcomm:qca6390_firmware:-
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cpe:2.3:o:qualcomm:qcn7605_firmware:-
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cpe:2.3:o:qualcomm:qcn7606_firmware:-
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cpe:2.3:o:qualcomm:sa415m_firmware:-
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cpe:2.3:o:qualcomm:sa515m_firmware:-
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cpe:2.3:o:qualcomm:sa6155p_firmware:-
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cpe:2.3:o:qualcomm:sa8155p_firmware:-
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cpe:2.3:o:qualcomm:sc8180x_firmware:-
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cpe:2.3:o:qualcomm:sdx55_firmware:-