Vulnerability Details CVE-2020-11154
u'Buffer overflow while processing a crafted PDU data packet in bluetooth due to lack of check of buffer size before copying' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, QCA6390, QCN7605, QCN7606, SA415M, SA515M, SA6155P, SA8155P, SC8180X, SDX55
Exploit prediction scoring system (EPSS) score
EPSS Score 0.002
EPSS Ranking 40.9%
CVSS Severity
CVSS v3 Score 8.8
CVSS v2 Score 8.3
References
Products affected by CVE-2020-11154
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cpe:2.3:h:qualcomm:apq8009:-
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cpe:2.3:h:qualcomm:apq8053:-
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cpe:2.3:h:qualcomm:qca6390:-
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cpe:2.3:h:qualcomm:qcn7605:-
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cpe:2.3:h:qualcomm:qcn7606:-
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cpe:2.3:h:qualcomm:sa415m:-
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cpe:2.3:h:qualcomm:sa515m:-
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cpe:2.3:h:qualcomm:sa6155p:-
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cpe:2.3:h:qualcomm:sa8155p:-
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cpe:2.3:h:qualcomm:sc8180x:-
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cpe:2.3:h:qualcomm:sdx55:-
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cpe:2.3:o:qualcomm:apq8009_firmware:-
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cpe:2.3:o:qualcomm:apq8053_firmware:-
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cpe:2.3:o:qualcomm:qca6390_firmware:-
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cpe:2.3:o:qualcomm:qcn7605_firmware:-
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cpe:2.3:o:qualcomm:qcn7606_firmware:-
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cpe:2.3:o:qualcomm:sa415m_firmware:-
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cpe:2.3:o:qualcomm:sa515m_firmware:-
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cpe:2.3:o:qualcomm:sa6155p_firmware:-
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cpe:2.3:o:qualcomm:sa8155p_firmware:-
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cpe:2.3:o:qualcomm:sc8180x_firmware:-
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cpe:2.3:o:qualcomm:sdx55_firmware:-