Vulnerability Details CVE-2020-11133
u'Possible out of bound array write in rxdco cal utility due to lack of array bound check' in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MSM8998, QCS605, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SXR1130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 12.7%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 4.6
References
Products affected by CVE-2020-11133
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cpe:2.3:h:qualcomm:msm8998:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:sda845:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm636:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sdm670:-
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cpe:2.3:h:qualcomm:sdm710:-
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cpe:2.3:h:qualcomm:sdm845:-
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cpe:2.3:h:qualcomm:sdm850:-
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cpe:2.3:h:qualcomm:sxr1130:-
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cpe:2.3:o:qualcomm:msm8998_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:sda845_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm636_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sdm670_firmware:-
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cpe:2.3:o:qualcomm:sdm710_firmware:-
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cpe:2.3:o:qualcomm:sdm845_firmware:-
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cpe:2.3:o:qualcomm:sdm850_firmware:-
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cpe:2.3:o:qualcomm:sxr1130_firmware:-