Vulnerability Details CVE-2019-2339
Out of bound access due to lack of check of whiltelist array size while reading the image elf segments. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 27.5%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2019-2339
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cpe:2.3:h:qualcomm:mdm9205:-
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cpe:2.3:h:qualcomm:qcs404:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:sda845:-
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cpe:2.3:h:qualcomm:sdm670:-
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cpe:2.3:h:qualcomm:sdm710:-
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cpe:2.3:h:qualcomm:sdm845:-
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cpe:2.3:h:qualcomm:sdm850:-
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cpe:2.3:h:qualcomm:sdx24:-
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cpe:2.3:h:qualcomm:sdx55:-
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cpe:2.3:h:qualcomm:sm6150:-
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cpe:2.3:h:qualcomm:sm7150:-
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cpe:2.3:h:qualcomm:sm8150:-
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cpe:2.3:h:qualcomm:sxr1130:-
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cpe:2.3:h:qualcomm:sxr2130:-
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cpe:2.3:o:qualcomm:mdm9205_firmware:-
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cpe:2.3:o:qualcomm:qcs404_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:sda845_firmware:-
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cpe:2.3:o:qualcomm:sdm670_firmware:-
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cpe:2.3:o:qualcomm:sdm710_firmware:-
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cpe:2.3:o:qualcomm:sdm845_firmware:-
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cpe:2.3:o:qualcomm:sdm850_firmware:-
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cpe:2.3:o:qualcomm:sdx24_firmware:-
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cpe:2.3:o:qualcomm:sdx55_firmware:-
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cpe:2.3:o:qualcomm:sm6150_firmware:-
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cpe:2.3:o:qualcomm:sm7150_firmware:-
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cpe:2.3:o:qualcomm:sm8150_firmware:-
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cpe:2.3:o:qualcomm:sxr1130_firmware:-
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cpe:2.3:o:qualcomm:sxr2130_firmware:-