Vulnerability Details CVE-2019-2332
Memory corruption while accessing the memory as payload size is not validated before access in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24
Exploit prediction scoring system (EPSS) score
EPSS Score 0.003
EPSS Ranking 55.2%
CVSS Severity
CVSS v3 Score 9.8
CVSS v2 Score 10.0
Products affected by CVE-2019-2332
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cpe:2.3:h:qualcomm:mdm9150:-
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9615:-
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cpe:2.3:h:qualcomm:mdm9640:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:msm8909w:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:qcs405:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:qualcomm_215:-
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cpe:2.3:h:qualcomm:sd_205:-
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cpe:2.3:h:qualcomm:sd_210:-
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cpe:2.3:h:qualcomm:sd_212:-
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cpe:2.3:h:qualcomm:sd_415:-
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cpe:2.3:h:qualcomm:sd_425:-
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cpe:2.3:h:qualcomm:sd_427:-
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cpe:2.3:h:qualcomm:sd_429:-
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cpe:2.3:h:qualcomm:sd_430:-
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cpe:2.3:h:qualcomm:sd_435:-
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cpe:2.3:h:qualcomm:sd_439:-
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cpe:2.3:h:qualcomm:sd_450:-
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cpe:2.3:h:qualcomm:sd_600:-
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cpe:2.3:h:qualcomm:sd_615:-
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cpe:2.3:h:qualcomm:sd_616:-
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cpe:2.3:h:qualcomm:sd_625:-
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cpe:2.3:h:qualcomm:sd_632:-
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cpe:2.3:h:qualcomm:sd_636:-
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cpe:2.3:h:qualcomm:sd_665:-
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cpe:2.3:h:qualcomm:sd_670:-
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cpe:2.3:h:qualcomm:sd_675:-
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cpe:2.3:h:qualcomm:sd_710:-
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cpe:2.3:h:qualcomm:sd_712:-
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cpe:2.3:h:qualcomm:sd_730:-
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cpe:2.3:h:qualcomm:sd_820:-
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cpe:2.3:h:qualcomm:sd_820a:-
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cpe:2.3:h:qualcomm:sd_835:-
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cpe:2.3:h:qualcomm:sd_845:-
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cpe:2.3:h:qualcomm:sd_850:-
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cpe:2.3:h:qualcomm:sd_855:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm439:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sdx20:-
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cpe:2.3:h:qualcomm:sdx24:-
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cpe:2.3:o:qualcomm:mdm9150_firmware:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9615_firmware:-
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cpe:2.3:o:qualcomm:mdm9640_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:msm8909w_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:qcs405_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:qualcomm_215_firmware:-
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cpe:2.3:o:qualcomm:sd_205_firmware:-
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cpe:2.3:o:qualcomm:sd_210_firmware:-
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cpe:2.3:o:qualcomm:sd_212_firmware:-
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cpe:2.3:o:qualcomm:sd_415_firmware:-
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cpe:2.3:o:qualcomm:sd_425_firmware:-
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cpe:2.3:o:qualcomm:sd_427_firmware:-
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cpe:2.3:o:qualcomm:sd_429_firmware:-
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cpe:2.3:o:qualcomm:sd_430_firmware:-
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cpe:2.3:o:qualcomm:sd_435_firmware:-
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cpe:2.3:o:qualcomm:sd_439_firmware:-
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cpe:2.3:o:qualcomm:sd_450_firmware:-
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cpe:2.3:o:qualcomm:sd_600_firmware:-
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cpe:2.3:o:qualcomm:sd_615_firmware:-
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cpe:2.3:o:qualcomm:sd_616_firmware:-
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cpe:2.3:o:qualcomm:sd_625_firmware:-
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cpe:2.3:o:qualcomm:sd_632_firmware:-
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cpe:2.3:o:qualcomm:sd_636_firmware:-
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cpe:2.3:o:qualcomm:sd_665_firmware:-
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cpe:2.3:o:qualcomm:sd_670_firmware:-
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cpe:2.3:o:qualcomm:sd_675_firmware:-
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cpe:2.3:o:qualcomm:sd_710_firmware:-
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cpe:2.3:o:qualcomm:sd_712_firmware:-
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cpe:2.3:o:qualcomm:sd_730_firmware:-
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cpe:2.3:o:qualcomm:sd_820_firmware:-
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cpe:2.3:o:qualcomm:sd_820a_firmware:-
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cpe:2.3:o:qualcomm:sd_835_firmware:-
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cpe:2.3:o:qualcomm:sd_845_firmware:-
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cpe:2.3:o:qualcomm:sd_850_firmware:-
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cpe:2.3:o:qualcomm:sd_855_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm439_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sdx20_firmware:-
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cpe:2.3:o:qualcomm:sdx24_firmware:-