Vulnerability Details CVE-2019-2329
Use after free issue in cleanup routine due to missing pointer sanitization for a failed start of a trusted application. in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, QCS605, SDA845, SDM670, SDM710, SDM845, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 26.6%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2019-2329
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cpe:2.3:h:qualcomm:mdm9205:-
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cpe:2.3:h:qualcomm:qcs404:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:sda845:-
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cpe:2.3:h:qualcomm:sdm670:-
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cpe:2.3:h:qualcomm:sdm710:-
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cpe:2.3:h:qualcomm:sdm845:-
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cpe:2.3:h:qualcomm:sdx55:-
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cpe:2.3:h:qualcomm:sm6150:-
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cpe:2.3:h:qualcomm:sm7150:-
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cpe:2.3:h:qualcomm:sm8150:-
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cpe:2.3:h:qualcomm:sxr1130:-
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cpe:2.3:h:qualcomm:sxr2130:-
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cpe:2.3:o:qualcomm:mdm9205_firmware:-
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cpe:2.3:o:qualcomm:qcs404_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:sda845_firmware:-
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cpe:2.3:o:qualcomm:sdm670_firmware:-
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cpe:2.3:o:qualcomm:sdm710_firmware:-
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cpe:2.3:o:qualcomm:sdm845_firmware:-
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cpe:2.3:o:qualcomm:sdx55_firmware:-
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cpe:2.3:o:qualcomm:sm6150_firmware:-
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cpe:2.3:o:qualcomm:sm7150_firmware:-
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cpe:2.3:o:qualcomm:sm8150_firmware:-
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cpe:2.3:o:qualcomm:sxr1130_firmware:-
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cpe:2.3:o:qualcomm:sxr2130_firmware:-