Vulnerability Details CVE-2019-2288
Out of bound write in TZ while copying the secure dump structure on HLOS provided buffer as a part of memory dump in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8976, MSM8996, MSM8996AU, MSM8998, QCA8081, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, Snapdragon_High_Med_2016, SXR1130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 27.6%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
Products affected by CVE-2019-2288
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cpe:2.3:h:qualcomm:apq8009:-
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cpe:2.3:h:qualcomm:apq8017:-
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cpe:2.3:h:qualcomm:apq8053:-
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cpe:2.3:h:qualcomm:apq8096:-
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cpe:2.3:h:qualcomm:apq8096au:-
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cpe:2.3:h:qualcomm:apq8098:-
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cpe:2.3:h:qualcomm:ipq8074:-
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cpe:2.3:h:qualcomm:mdm9150:-
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:msm8905:-
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cpe:2.3:h:qualcomm:msm8909:-
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cpe:2.3:h:qualcomm:msm8917:-
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cpe:2.3:h:qualcomm:msm8920:-
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cpe:2.3:h:qualcomm:msm8937:-
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cpe:2.3:h:qualcomm:msm8940:-
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cpe:2.3:h:qualcomm:msm8953:-
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cpe:2.3:h:qualcomm:msm8976:-
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cpe:2.3:h:qualcomm:msm8996:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:msm8998:-
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cpe:2.3:h:qualcomm:qca8081:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:qm215:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sda845:-
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cpe:2.3:h:qualcomm:sdm429:-
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cpe:2.3:h:qualcomm:sdm439:-
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cpe:2.3:h:qualcomm:sdm450:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm632:-
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cpe:2.3:h:qualcomm:sdm636:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sdm670:-
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cpe:2.3:h:qualcomm:sdm710:-
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cpe:2.3:h:qualcomm:sdm845:-
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cpe:2.3:h:qualcomm:sdm850:-
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cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-
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cpe:2.3:h:qualcomm:sxr1130:-
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cpe:2.3:o:qualcomm:apq8009_firmware:-
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cpe:2.3:o:qualcomm:apq8017_firmware:-
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cpe:2.3:o:qualcomm:apq8053_firmware:-
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cpe:2.3:o:qualcomm:apq8096_firmware:-
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cpe:2.3:o:qualcomm:apq8096au_firmware:-
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cpe:2.3:o:qualcomm:apq8098_firmware:-
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cpe:2.3:o:qualcomm:ipq8074_firmware:-
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cpe:2.3:o:qualcomm:mdm9150_firmware:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:msm8905_firmware:-
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cpe:2.3:o:qualcomm:msm8909_firmware:-
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cpe:2.3:o:qualcomm:msm8917_firmware:-
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cpe:2.3:o:qualcomm:msm8920_firmware:-
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cpe:2.3:o:qualcomm:msm8937_firmware:-
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cpe:2.3:o:qualcomm:msm8940_firmware:-
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cpe:2.3:o:qualcomm:msm8953_firmware:-
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cpe:2.3:o:qualcomm:msm8976_firmware:-
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cpe:2.3:o:qualcomm:msm8996_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:msm8998_firmware:-
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cpe:2.3:o:qualcomm:qca8081_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:qm215_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sda845_firmware:-
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cpe:2.3:o:qualcomm:sdm429_firmware:-
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cpe:2.3:o:qualcomm:sdm439_firmware:-
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cpe:2.3:o:qualcomm:sdm450_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm632_firmware:-
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cpe:2.3:o:qualcomm:sdm636_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sdm670_firmware:-
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cpe:2.3:o:qualcomm:sdm710_firmware:-
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cpe:2.3:o:qualcomm:sdm845_firmware:-
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cpe:2.3:o:qualcomm:sdm850_firmware:-
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cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-
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cpe:2.3:o:qualcomm:sxr1130_firmware:-