Vulnerability Details CVE-2019-2267
Locked regions may be modified through other interfaces in secure boot loader image due to improper access control. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SM8150, SXR1130, SXR2130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 27.5%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2019-2267
-
cpe:2.3:h:qualcomm:mdm9205:-
-
cpe:2.3:h:qualcomm:qcs404:-
-
cpe:2.3:h:qualcomm:qcs605:-
-
cpe:2.3:h:qualcomm:sda845:-
-
cpe:2.3:h:qualcomm:sdm670:-
-
cpe:2.3:h:qualcomm:sdm710:-
-
cpe:2.3:h:qualcomm:sdm845:-
-
cpe:2.3:h:qualcomm:sdm850:-
-
cpe:2.3:h:qualcomm:sm8150:-
-
cpe:2.3:h:qualcomm:sxr1130:-
-
cpe:2.3:h:qualcomm:sxr2130:-
-
cpe:2.3:o:qualcomm:mdm9205_firmware:-
-
cpe:2.3:o:qualcomm:qcs404_firmware:-
-
cpe:2.3:o:qualcomm:qcs605_firmware:-
-
cpe:2.3:o:qualcomm:sda845_firmware:-
-
cpe:2.3:o:qualcomm:sdm670_firmware:-
-
cpe:2.3:o:qualcomm:sdm710_firmware:-
-
cpe:2.3:o:qualcomm:sdm845_firmware:-
-
cpe:2.3:o:qualcomm:sdm850_firmware:-
-
cpe:2.3:o:qualcomm:sm8150_firmware:-
-
cpe:2.3:o:qualcomm:sxr1130_firmware:-
-
cpe:2.3:o:qualcomm:sxr2130_firmware:-