Vulnerability Details CVE-2019-2266
Possible double free issue in kernel while handling the camera sensor and its sub modules power sequence in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8053, IPQ4019, IPQ8064, MDM9206, MDM9207C, MDM9607, MSM8909, MSM8909W, Nicobar, QCA9980, QCS405, QCS605, SDM845, SDX24, SM7150, SM8150
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 12.4%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 4.6
References
Products affected by CVE-2019-2266
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cpe:2.3:h:qualcomm:apq8053:-
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cpe:2.3:h:qualcomm:ipq4019:-
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cpe:2.3:h:qualcomm:ipq8064:-
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9207c:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:msm8909:-
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cpe:2.3:h:qualcomm:msm8909w:-
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cpe:2.3:h:qualcomm:nicobar:-
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cpe:2.3:h:qualcomm:qca9980:-
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cpe:2.3:h:qualcomm:qcs405:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:sdm845:-
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cpe:2.3:h:qualcomm:sdx24:-
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cpe:2.3:h:qualcomm:sm7150:-
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cpe:2.3:h:qualcomm:sm8150:-
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cpe:2.3:o:qualcomm:apq8053_firmware:-
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cpe:2.3:o:qualcomm:ipq4019_firmware:-
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cpe:2.3:o:qualcomm:ipq8064_firmware:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9207c_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:msm8909_firmware:-
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cpe:2.3:o:qualcomm:msm8909w_firmware:-
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cpe:2.3:o:qualcomm:nicobar_firmware:-
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cpe:2.3:o:qualcomm:qca9980_firmware:-
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cpe:2.3:o:qualcomm:qcs405_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:sdm845_firmware:-
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cpe:2.3:o:qualcomm:sdx24_firmware:-
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cpe:2.3:o:qualcomm:sm7150_firmware:-
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cpe:2.3:o:qualcomm:sm8150_firmware:-