Vulnerability Details CVE-2019-2238
Lack of check of data type can lead to subsequent loop-expression potentially go negative and the condition will still evaluate to true leading to buffer underflow. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 12.7%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 4.6
References
Products affected by CVE-2019-2238
-
cpe:2.3:h:qualcomm:mdm9206:-
-
cpe:2.3:h:qualcomm:mdm9607:-
-
cpe:2.3:h:qualcomm:mdm9650:-
-
cpe:2.3:h:qualcomm:mdm9655:-
-
cpe:2.3:h:qualcomm:qcs605:-
-
cpe:2.3:h:qualcomm:sd_205:-
-
cpe:2.3:h:qualcomm:sd_210:-
-
cpe:2.3:h:qualcomm:sd_212:-
-
cpe:2.3:h:qualcomm:sd_410:-
-
cpe:2.3:h:qualcomm:sd_412:-
-
cpe:2.3:h:qualcomm:sd_670:-
-
cpe:2.3:h:qualcomm:sd_675:-
-
cpe:2.3:h:qualcomm:sd_710:-
-
cpe:2.3:h:qualcomm:sd_712:-
-
cpe:2.3:h:qualcomm:sd_730:-
-
cpe:2.3:h:qualcomm:sd_8cx:-
-
cpe:2.3:h:qualcomm:sxr1130:-
-
cpe:2.3:o:qualcomm:mdm9206_firmware:-
-
cpe:2.3:o:qualcomm:mdm9607_firmware:-
-
cpe:2.3:o:qualcomm:mdm9650_firmware:-
-
cpe:2.3:o:qualcomm:mdm9655_firmware:-
-
cpe:2.3:o:qualcomm:qcs605_firmware:-
-
cpe:2.3:o:qualcomm:sd_205_firmware:-
-
cpe:2.3:o:qualcomm:sd_210_firmware:-
-
cpe:2.3:o:qualcomm:sd_212_firmware:-
-
cpe:2.3:o:qualcomm:sd_410_firmware:-
-
cpe:2.3:o:qualcomm:sd_412_firmware:-
-
cpe:2.3:o:qualcomm:sd_670_firmware:-
-
cpe:2.3:o:qualcomm:sd_675_firmware:-
-
cpe:2.3:o:qualcomm:sd_710_firmware:-
-
cpe:2.3:o:qualcomm:sd_712_firmware:-
-
cpe:2.3:o:qualcomm:sd_730_firmware:-
-
cpe:2.3:o:qualcomm:sd_8cx_firmware:-
-
cpe:2.3:o:qualcomm:sxr1130_firmware:-