Vulnerability Details CVE-2019-2237
Failure in taking appropriate action to handle the error case If keypad gpio deactivation fails leads to silent failure scenario and subsequent logic gets executed everytime in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 8CX, SXR1130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 14.9%
CVSS Severity
CVSS v3 Score 5.5
CVSS v2 Score 2.1
References
Products affected by CVE-2019-2237
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:mdm9655:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:sd_205:-
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cpe:2.3:h:qualcomm:sd_210:-
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cpe:2.3:h:qualcomm:sd_212:-
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cpe:2.3:h:qualcomm:sd_410:-
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cpe:2.3:h:qualcomm:sd_412:-
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cpe:2.3:h:qualcomm:sd_670:-
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cpe:2.3:h:qualcomm:sd_675:-
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cpe:2.3:h:qualcomm:sd_710:-
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cpe:2.3:h:qualcomm:sd_712:-
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cpe:2.3:h:qualcomm:sd_730:-
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cpe:2.3:h:qualcomm:sd_8cx:-
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cpe:2.3:h:qualcomm:sxr1130:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:mdm9655_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:sd_205_firmware:-
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cpe:2.3:o:qualcomm:sd_210_firmware:-
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cpe:2.3:o:qualcomm:sd_212_firmware:-
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cpe:2.3:o:qualcomm:sd_410_firmware:-
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cpe:2.3:o:qualcomm:sd_412_firmware:-
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cpe:2.3:o:qualcomm:sd_670_firmware:-
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cpe:2.3:o:qualcomm:sd_675_firmware:-
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cpe:2.3:o:qualcomm:sd_710_firmware:-
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cpe:2.3:o:qualcomm:sd_712_firmware:-
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cpe:2.3:o:qualcomm:sd_730_firmware:-
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cpe:2.3:o:qualcomm:sd_8cx_firmware:-
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cpe:2.3:o:qualcomm:sxr1130_firmware:-