Vulnerability Details CVE-2019-14078
Out of bound memory access while processing qpay due to not validating length of the response buffer provided by User. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8098, MSM8909, MSM8998, SDA660, SDA845, SDM630, SDM636, SDM660, SDM845
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 12.6%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 4.6
References
Products affected by CVE-2019-14078
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cpe:2.3:h:qualcomm:apq8009:-
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cpe:2.3:h:qualcomm:apq8098:-
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cpe:2.3:h:qualcomm:msm8909:-
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cpe:2.3:h:qualcomm:msm8998:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sda845:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm636:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sdm845:-
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cpe:2.3:o:qualcomm:apq8009_firmware:-
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cpe:2.3:o:qualcomm:apq8098_firmware:-
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cpe:2.3:o:qualcomm:msm8909_firmware:-
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cpe:2.3:o:qualcomm:msm8998_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sda845_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm636_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sdm845_firmware:-