Vulnerability Details CVE-2019-14066
Integer overflow in calculating estimated output buffer size when getting a list of installed Feature IDs, Serial Numbers or checking Feature ID status in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in Kamorta, MDM9205, MDM9607, Nicobar, QCS404, QCS405, Rennell, SA6155P, SC7180, SC8180X, SDX55, SM6150, SM7150, SXR2130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 8.1%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2019-14066
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cpe:2.3:h:qualcomm:kamorta:-
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cpe:2.3:h:qualcomm:mdm9205:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:nicobar:-
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cpe:2.3:h:qualcomm:qcs404:-
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cpe:2.3:h:qualcomm:qcs405:-
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cpe:2.3:h:qualcomm:rennell:-
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cpe:2.3:h:qualcomm:sa6155p:-
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cpe:2.3:h:qualcomm:sc7180:-
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cpe:2.3:h:qualcomm:sc8180x:-
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cpe:2.3:h:qualcomm:sdx55:-
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cpe:2.3:h:qualcomm:sm6150:-
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cpe:2.3:h:qualcomm:sm7150:-
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cpe:2.3:h:qualcomm:sxr2130:-
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cpe:2.3:o:qualcomm:kamorta_firmware:-
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cpe:2.3:o:qualcomm:mdm9205_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:nicobar_firmware:-
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cpe:2.3:o:qualcomm:qcs404_firmware:-
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cpe:2.3:o:qualcomm:qcs405_firmware:-
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cpe:2.3:o:qualcomm:rennell_firmware:-
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cpe:2.3:o:qualcomm:sa6155p_firmware:-
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cpe:2.3:o:qualcomm:sc7180_firmware:-
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cpe:2.3:o:qualcomm:sc8180x_firmware:-
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cpe:2.3:o:qualcomm:sdx55_firmware:-
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cpe:2.3:o:qualcomm:sm6150_firmware:-
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cpe:2.3:o:qualcomm:sm7150_firmware:-
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cpe:2.3:o:qualcomm:sxr2130_firmware:-