Vulnerability Details CVE-2019-14036
Possible buffer overflow issue in error processing due to improper validation of array index value in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8064, APQ8096AU, IPQ4019, IPQ8064, IPQ8074, MDM9607, MDM9615, MDM9640, MSM8996AU, QCN7605
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 8.7%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2019-14036
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cpe:2.3:h:qualcomm:apq8064:-
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cpe:2.3:h:qualcomm:apq8096au:-
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cpe:2.3:h:qualcomm:ipq4019:-
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cpe:2.3:h:qualcomm:ipq8064:-
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cpe:2.3:h:qualcomm:ipq8074:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9615:-
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cpe:2.3:h:qualcomm:mdm9640:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:qcn7605:-
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cpe:2.3:o:qualcomm:apq8064_firmware:-
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cpe:2.3:o:qualcomm:apq8096au_firmware:-
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cpe:2.3:o:qualcomm:ipq4019_firmware:-
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cpe:2.3:o:qualcomm:ipq8064_firmware:-
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cpe:2.3:o:qualcomm:ipq8074_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9615_firmware:-
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cpe:2.3:o:qualcomm:mdm9640_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:qcn7605_firmware:-