Vulnerability Details CVE-2019-14030
The size of a buffer is determined by addition and multiplications operations that have the potential to overflow due to lack of bound check in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, Rennell, SC8180X, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 7.9%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2019-14030
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cpe:2.3:h:qualcomm:mdm9205:-
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cpe:2.3:h:qualcomm:qcs404:-
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cpe:2.3:h:qualcomm:rennell:-
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cpe:2.3:h:qualcomm:sc8180x:-
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cpe:2.3:h:qualcomm:sdm845:-
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cpe:2.3:h:qualcomm:sdm850:-
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cpe:2.3:h:qualcomm:sdx55:-
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cpe:2.3:h:qualcomm:sm6150:-
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cpe:2.3:h:qualcomm:sm7150:-
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cpe:2.3:h:qualcomm:sm8150:-
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cpe:2.3:h:qualcomm:sm8250:-
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cpe:2.3:h:qualcomm:sxr2130:-
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cpe:2.3:o:qualcomm:mdm9205_firmware:-
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cpe:2.3:o:qualcomm:qcs404_firmware:-
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cpe:2.3:o:qualcomm:rennell_firmware:-
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cpe:2.3:o:qualcomm:sc8180x_firmware:-
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cpe:2.3:o:qualcomm:sdm845_firmware:-
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cpe:2.3:o:qualcomm:sdm850_firmware:-
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cpe:2.3:o:qualcomm:sdx55_firmware:-
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cpe:2.3:o:qualcomm:sm6150_firmware:-
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cpe:2.3:o:qualcomm:sm7150_firmware:-
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cpe:2.3:o:qualcomm:sm8150_firmware:-
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cpe:2.3:o:qualcomm:sm8250_firmware:-
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cpe:2.3:o:qualcomm:sxr2130_firmware:-