Vulnerability Details CVE-2019-10625
Out of bound access in diag services when DCI command buffer reallocation is not done properly with required capacity in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009, APQ8096AU, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, QCS605, Rennell, SC8180X, SDM429W, SDM710, SDX55, SM7150, SM8150
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 12.7%
CVSS Severity
CVSS v3 Score 7.1
CVSS v2 Score 3.6
References
Products affected by CVE-2019-10625
-
cpe:2.3:h:qualcomm:apq8009:-
-
cpe:2.3:h:qualcomm:apq8096au:-
-
cpe:2.3:h:qualcomm:mdm9206:-
-
cpe:2.3:h:qualcomm:mdm9207c:-
-
cpe:2.3:h:qualcomm:mdm9607:-
-
cpe:2.3:h:qualcomm:mdm9640:-
-
cpe:2.3:h:qualcomm:mdm9650:-
-
cpe:2.3:h:qualcomm:qcs605:-
-
cpe:2.3:h:qualcomm:rennell:-
-
cpe:2.3:h:qualcomm:sc8180x:-
-
cpe:2.3:h:qualcomm:sdm429w:-
-
cpe:2.3:h:qualcomm:sdm710:-
-
cpe:2.3:h:qualcomm:sdx55:-
-
cpe:2.3:h:qualcomm:sm7150:-
-
cpe:2.3:h:qualcomm:sm8150:-
-
cpe:2.3:o:qualcomm:apq8009_firmware:-
-
cpe:2.3:o:qualcomm:apq8096au_firmware:-
-
cpe:2.3:o:qualcomm:mdm9206_firmware:-
-
cpe:2.3:o:qualcomm:mdm9207c_firmware:-
-
cpe:2.3:o:qualcomm:mdm9607_firmware:-
-
cpe:2.3:o:qualcomm:mdm9640_firmware:-
-
cpe:2.3:o:qualcomm:mdm9650_firmware:-
-
cpe:2.3:o:qualcomm:qcs605_firmware:-
-
cpe:2.3:o:qualcomm:rennell_firmware:-
-
cpe:2.3:o:qualcomm:sc8180x_firmware:-
-
cpe:2.3:o:qualcomm:sdm429w_firmware:-
-
cpe:2.3:o:qualcomm:sdm710_firmware:-
-
cpe:2.3:o:qualcomm:sdx55_firmware:-
-
cpe:2.3:o:qualcomm:sm7150_firmware:-
-
cpe:2.3:o:qualcomm:sm8150_firmware:-