Vulnerability Details CVE-2019-10612
UTCB object has a function pointer called by the reaper to deallocate its memory resources and this address can potentially be corrupted by stack overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, MDM9650, QCS605, SA6155P, SC8180X, SDA845, SDM670, SDM710, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.004
EPSS Ranking 57.1%
CVSS Severity
CVSS v3 Score 9.8
CVSS v2 Score 10.0
References
Products affected by CVE-2019-10612
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cpe:2.3:h:qualcomm:mdm9205:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:sa6155p:-
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cpe:2.3:h:qualcomm:sc8180x:-
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cpe:2.3:h:qualcomm:sda845:-
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cpe:2.3:h:qualcomm:sdm670:-
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cpe:2.3:h:qualcomm:sdm710:-
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cpe:2.3:h:qualcomm:sdm845:-
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cpe:2.3:h:qualcomm:sdm850:-
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cpe:2.3:h:qualcomm:sdx55:-
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cpe:2.3:h:qualcomm:sm6150:-
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cpe:2.3:h:qualcomm:sm7150:-
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cpe:2.3:h:qualcomm:sm8150:-
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cpe:2.3:h:qualcomm:sm8250:-
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cpe:2.3:h:qualcomm:sxr1130:-
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cpe:2.3:h:qualcomm:sxr2130:-
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cpe:2.3:o:qualcomm:mdm9205_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:sa6155p_firmware:-
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cpe:2.3:o:qualcomm:sc8180x_firmware:-
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cpe:2.3:o:qualcomm:sda845_firmware:-
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cpe:2.3:o:qualcomm:sdm670_firmware:-
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cpe:2.3:o:qualcomm:sdm710_firmware:-
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cpe:2.3:o:qualcomm:sdm845_firmware:-
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cpe:2.3:o:qualcomm:sdm850_firmware:-
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cpe:2.3:o:qualcomm:sdx55_firmware:-
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cpe:2.3:o:qualcomm:sm6150_firmware:-
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cpe:2.3:o:qualcomm:sm7150_firmware:-
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cpe:2.3:o:qualcomm:sm8150_firmware:-
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cpe:2.3:o:qualcomm:sm8250_firmware:-
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cpe:2.3:o:qualcomm:sxr1130_firmware:-
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cpe:2.3:o:qualcomm:sxr2130_firmware:-