Vulnerability Details CVE-2019-10605
Buffer overwrite can occur in IEEE80211 header filling function due to lack of range check of array index received from firmware in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8053, IPQ8074, MDM9607, MDM9650, MSM8909, MSM8939, QCN7605, SDA660, SDM630, SDM636, SDM660, SDX20, SDX24
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 27.5%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2019-10605
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cpe:2.3:h:qualcomm:apq8009:-
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cpe:2.3:h:qualcomm:apq8053:-
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cpe:2.3:h:qualcomm:ipq8074:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:msm8909:-
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cpe:2.3:h:qualcomm:msm8939:-
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cpe:2.3:h:qualcomm:qcn7605:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm636:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sdx20:-
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cpe:2.3:h:qualcomm:sdx24:-
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cpe:2.3:o:qualcomm:apq8009_firmware:-
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cpe:2.3:o:qualcomm:apq8053_firmware:-
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cpe:2.3:o:qualcomm:ipq8074_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:msm8909_firmware:-
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cpe:2.3:o:qualcomm:msm8939_firmware:-
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cpe:2.3:o:qualcomm:qcn7605_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm636_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sdx20_firmware:-
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cpe:2.3:o:qualcomm:sdx24_firmware:-