Vulnerability Details CVE-2019-10602
Potential use-after-free heap error during Validate/Present calls on display HW composer in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9650, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, QCS605, SDA660, SDM845, SDX20, SM8150
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 10.0%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2019-10602
-
cpe:2.3:h:qualcomm:apq8053:-
-
cpe:2.3:h:qualcomm:apq8096au:-
-
cpe:2.3:h:qualcomm:apq8098:-
-
cpe:2.3:h:qualcomm:mdm9206:-
-
cpe:2.3:h:qualcomm:mdm9207c:-
-
cpe:2.3:h:qualcomm:mdm9607:-
-
cpe:2.3:h:qualcomm:mdm9650:-
-
cpe:2.3:h:qualcomm:msm8909w:-
-
cpe:2.3:h:qualcomm:msm8917:-
-
cpe:2.3:h:qualcomm:msm8920:-
-
cpe:2.3:h:qualcomm:msm8937:-
-
cpe:2.3:h:qualcomm:msm8940:-
-
cpe:2.3:h:qualcomm:msm8953:-
-
cpe:2.3:h:qualcomm:msm8996au:-
-
cpe:2.3:h:qualcomm:qcs605:-
-
cpe:2.3:h:qualcomm:sda660:-
-
cpe:2.3:h:qualcomm:sdm845:-
-
cpe:2.3:h:qualcomm:sdx20:-
-
cpe:2.3:h:qualcomm:sm8150:-
-
cpe:2.3:o:qualcomm:apq8053_firmware:-
-
cpe:2.3:o:qualcomm:apq8096au_firmware:-
-
cpe:2.3:o:qualcomm:apq8098_firmware:-
-
cpe:2.3:o:qualcomm:mdm9206_firmware:-
-
cpe:2.3:o:qualcomm:mdm9207c_firmware:-
-
cpe:2.3:o:qualcomm:mdm9607_firmware:-
-
cpe:2.3:o:qualcomm:mdm9650_firmware:-
-
cpe:2.3:o:qualcomm:msm8909w_firmware:-
-
cpe:2.3:o:qualcomm:msm8917_firmware:-
-
cpe:2.3:o:qualcomm:msm8920_firmware:-
-
cpe:2.3:o:qualcomm:msm8937_firmware:-
-
cpe:2.3:o:qualcomm:msm8940_firmware:-
-
cpe:2.3:o:qualcomm:msm8953_firmware:-
-
cpe:2.3:o:qualcomm:msm8996au_firmware:-
-
cpe:2.3:o:qualcomm:qcs605_firmware:-
-
cpe:2.3:o:qualcomm:sda660_firmware:-
-
cpe:2.3:o:qualcomm:sdm845_firmware:-
-
cpe:2.3:o:qualcomm:sdx20_firmware:-
-
cpe:2.3:o:qualcomm:sm8150_firmware:-