Vulnerability Details CVE-2019-10509
Device record of the pairing device used after free during ACL disconnection in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MSM8909W, MSM8996AU, QCA6574AU, QCS405, QCS605, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016
Exploit prediction scoring system (EPSS) score
EPSS Score 0.003
EPSS Ranking 49.8%
CVSS Severity
CVSS v3 Score 9.8
CVSS v2 Score 10.0
Products affected by CVE-2019-10509
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cpe:2.3:h:qualcomm:msm8909w:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:qca6574au:-
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cpe:2.3:h:qualcomm:qcs405:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:sd_425:-
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cpe:2.3:h:qualcomm:sd_427:-
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cpe:2.3:h:qualcomm:sd_429:-
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cpe:2.3:h:qualcomm:sd_430:-
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cpe:2.3:h:qualcomm:sd_435:-
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cpe:2.3:h:qualcomm:sd_439:-
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cpe:2.3:h:qualcomm:sd_450:-
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cpe:2.3:h:qualcomm:sd_625:-
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cpe:2.3:h:qualcomm:sd_632:-
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cpe:2.3:h:qualcomm:sd_636:-
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cpe:2.3:h:qualcomm:sd_665:-
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cpe:2.3:h:qualcomm:sd_670:-
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cpe:2.3:h:qualcomm:sd_675:-
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cpe:2.3:h:qualcomm:sd_710:-
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cpe:2.3:h:qualcomm:sd_712:-
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cpe:2.3:h:qualcomm:sd_730:-
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cpe:2.3:h:qualcomm:sd_820:-
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cpe:2.3:h:qualcomm:sd_820a:-
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cpe:2.3:h:qualcomm:sd_835:-
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cpe:2.3:h:qualcomm:sd_845:-
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cpe:2.3:h:qualcomm:sd_850:-
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cpe:2.3:h:qualcomm:sd_855:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm439:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-
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cpe:2.3:o:qualcomm:msm8909w_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:qca6574au_firmware:-
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cpe:2.3:o:qualcomm:qcs405_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:sd_425_firmware:-
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cpe:2.3:o:qualcomm:sd_427_firmware:-
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cpe:2.3:o:qualcomm:sd_429_firmware:-
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cpe:2.3:o:qualcomm:sd_430_firmware:-
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cpe:2.3:o:qualcomm:sd_435_firmware:-
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cpe:2.3:o:qualcomm:sd_439_firmware:-
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cpe:2.3:o:qualcomm:sd_450_firmware:-
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cpe:2.3:o:qualcomm:sd_625_firmware:-
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cpe:2.3:o:qualcomm:sd_632_firmware:-
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cpe:2.3:o:qualcomm:sd_636_firmware:-
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cpe:2.3:o:qualcomm:sd_665_firmware:-
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cpe:2.3:o:qualcomm:sd_670_firmware:-
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cpe:2.3:o:qualcomm:sd_675_firmware:-
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cpe:2.3:o:qualcomm:sd_710_firmware:-
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cpe:2.3:o:qualcomm:sd_712_firmware:-
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cpe:2.3:o:qualcomm:sd_730_firmware:-
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cpe:2.3:o:qualcomm:sd_820_firmware:-
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cpe:2.3:o:qualcomm:sd_820a_firmware:-
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cpe:2.3:o:qualcomm:sd_835_firmware:-
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cpe:2.3:o:qualcomm:sd_845_firmware:-
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cpe:2.3:o:qualcomm:sd_850_firmware:-
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cpe:2.3:o:qualcomm:sd_855_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm439_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-