Vulnerability Details CVE-2018-5914
Improper input validation in TZ led to array out of bound in TZ function while accessing the peripheral details using the incoming data in Snapdragon Mobile, Snapdragon Wear version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 7.9%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2018-5914
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:sd_205:-
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cpe:2.3:h:qualcomm:sd_210:-
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cpe:2.3:h:qualcomm:sd_212:-
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cpe:2.3:h:qualcomm:sd_425:-
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cpe:2.3:h:qualcomm:sd_430:-
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cpe:2.3:h:qualcomm:sd_450:-
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cpe:2.3:h:qualcomm:sd_625:-
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cpe:2.3:h:qualcomm:sd_650:-
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cpe:2.3:h:qualcomm:sd_652:-
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cpe:2.3:h:qualcomm:sd_835:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:sd_205_firmware:-
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cpe:2.3:o:qualcomm:sd_210_firmware:-
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cpe:2.3:o:qualcomm:sd_212_firmware:-
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cpe:2.3:o:qualcomm:sd_425_firmware:-
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cpe:2.3:o:qualcomm:sd_430_firmware:-
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cpe:2.3:o:qualcomm:sd_450_firmware:-
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cpe:2.3:o:qualcomm:sd_625_firmware:-
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cpe:2.3:o:qualcomm:sd_650_firmware:-
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cpe:2.3:o:qualcomm:sd_652_firmware:-
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cpe:2.3:o:qualcomm:sd_835_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-