Vulnerability Details CVE-2018-5882
While parsing a Flac file with a corrupted comment block, a buffer over-read can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.004
EPSS Ranking 57.8%
CVSS Severity
CVSS v3 Score 9.8
CVSS v2 Score 7.5
References
Products affected by CVE-2018-5882
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:msm8909w:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:sd_205:-
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cpe:2.3:h:qualcomm:sd_210:-
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cpe:2.3:h:qualcomm:sd_212:-
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cpe:2.3:h:qualcomm:sd_415:-
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cpe:2.3:h:qualcomm:sd_425:-
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cpe:2.3:h:qualcomm:sd_430:-
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cpe:2.3:h:qualcomm:sd_450:-
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cpe:2.3:h:qualcomm:sd_600:-
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cpe:2.3:h:qualcomm:sd_615:-
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cpe:2.3:h:qualcomm:sd_616:-
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cpe:2.3:h:qualcomm:sd_617:-
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cpe:2.3:h:qualcomm:sd_625:-
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cpe:2.3:h:qualcomm:sd_650:-
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cpe:2.3:h:qualcomm:sd_652:-
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cpe:2.3:h:qualcomm:sd_820:-
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cpe:2.3:h:qualcomm:sd_820a:-
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cpe:2.3:h:qualcomm:sd_835:-
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cpe:2.3:h:qualcomm:sd_845:-
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cpe:2.3:h:qualcomm:sdx20:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:msm8909w_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:sd_205_firmware:-
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cpe:2.3:o:qualcomm:sd_210_firmware:-
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cpe:2.3:o:qualcomm:sd_212_firmware:-
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cpe:2.3:o:qualcomm:sd_415_firmware:-
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cpe:2.3:o:qualcomm:sd_425_firmware:-
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cpe:2.3:o:qualcomm:sd_430_firmware:-
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cpe:2.3:o:qualcomm:sd_450_firmware:-
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cpe:2.3:o:qualcomm:sd_600_firmware:-
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cpe:2.3:o:qualcomm:sd_615_firmware:-
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cpe:2.3:o:qualcomm:sd_616_firmware:-
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cpe:2.3:o:qualcomm:sd_617_firmware:-
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cpe:2.3:o:qualcomm:sd_625_firmware:-
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cpe:2.3:o:qualcomm:sd_650_firmware:-
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cpe:2.3:o:qualcomm:sd_652_firmware:-
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cpe:2.3:o:qualcomm:sd_820_firmware:-
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cpe:2.3:o:qualcomm:sd_820a_firmware:-
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cpe:2.3:o:qualcomm:sd_835_firmware:-
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cpe:2.3:o:qualcomm:sd_845_firmware:-
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cpe:2.3:o:qualcomm:sdx20_firmware:-