Vulnerability Details CVE-2018-3583
A buffer overflow can occur while processing an extscan hotlist event in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9379, QCS605, SD 625, SD 636, SD 820, SD 820A, SD 835, SD 855, SDA660, SDM630, SDM660, SDX20
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 10.2%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2018-3583
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9640:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:msm8909w:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:qca9379:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:sd_625:-
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cpe:2.3:h:qualcomm:sd_636:-
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cpe:2.3:h:qualcomm:sd_820:-
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cpe:2.3:h:qualcomm:sd_820a:-
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cpe:2.3:h:qualcomm:sd_835:-
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cpe:2.3:h:qualcomm:sd_855:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sdx20:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9640_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:msm8909w_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:qca9379_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:sd_625_firmware:-
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cpe:2.3:o:qualcomm:sd_636_firmware:-
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cpe:2.3:o:qualcomm:sd_820_firmware:-
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cpe:2.3:o:qualcomm:sd_820a_firmware:-
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cpe:2.3:o:qualcomm:sd_835_firmware:-
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cpe:2.3:o:qualcomm:sd_855_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sdx20_firmware:-