Vulnerability Details CVE-2018-11970
TZ App dynamic allocations not protected from XBL loader in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SD 8CX, SDA660, SDM630, SDM660, SXR1130
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 8.1%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2018-11970
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:mdm9655:-
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cpe:2.3:h:qualcomm:qcs605:-
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cpe:2.3:h:qualcomm:sd_410:-
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cpe:2.3:h:qualcomm:sd_412:-
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cpe:2.3:h:qualcomm:sd_636:-
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cpe:2.3:h:qualcomm:sd_670:-
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cpe:2.3:h:qualcomm:sd_710:-
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cpe:2.3:h:qualcomm:sd_712:-
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cpe:2.3:h:qualcomm:sd_845:-
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cpe:2.3:h:qualcomm:sd_850:-
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cpe:2.3:h:qualcomm:sd_8cx:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sxr1130:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:mdm9655_firmware:-
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cpe:2.3:o:qualcomm:qcs605_firmware:-
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cpe:2.3:o:qualcomm:sd_410_firmware:-
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cpe:2.3:o:qualcomm:sd_412_firmware:-
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cpe:2.3:o:qualcomm:sd_636_firmware:-
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cpe:2.3:o:qualcomm:sd_670_firmware:-
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cpe:2.3:o:qualcomm:sd_710_firmware:-
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cpe:2.3:o:qualcomm:sd_712_firmware:-
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cpe:2.3:o:qualcomm:sd_845_firmware:-
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cpe:2.3:o:qualcomm:sd_850_firmware:-
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cpe:2.3:o:qualcomm:sd_8cx_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sxr1130_firmware:-