Vulnerability Details CVE-2018-11855
If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 8.7%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2018-11855
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:mdm9655:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:sd_205:-
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cpe:2.3:h:qualcomm:sd_210:-
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cpe:2.3:h:qualcomm:sd_212:-
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cpe:2.3:h:qualcomm:sd_410:-
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cpe:2.3:h:qualcomm:sd_412:-
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cpe:2.3:h:qualcomm:sd_636:-
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cpe:2.3:h:qualcomm:sd_820:-
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cpe:2.3:h:qualcomm:sd_820a:-
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cpe:2.3:h:qualcomm:sd_835:-
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cpe:2.3:h:qualcomm:sd_8cx:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:mdm9655_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:sd_205_firmware:-
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cpe:2.3:o:qualcomm:sd_210_firmware:-
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cpe:2.3:o:qualcomm:sd_212_firmware:-
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cpe:2.3:o:qualcomm:sd_410_firmware:-
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cpe:2.3:o:qualcomm:sd_412_firmware:-
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cpe:2.3:o:qualcomm:sd_636_firmware:-
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cpe:2.3:o:qualcomm:sd_820_firmware:-
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cpe:2.3:o:qualcomm:sd_820a_firmware:-
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cpe:2.3:o:qualcomm:sd_835_firmware:-
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cpe:2.3:o:qualcomm:sd_8cx_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-