Vulnerability Details CVE-2018-11277
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 10.1%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 4.6
Products affected by CVE-2018-11277
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cpe:2.3:h:qualcomm:msm8909w:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:sd205:-
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cpe:2.3:h:qualcomm:sd210:-
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cpe:2.3:h:qualcomm:sd212:-
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cpe:2.3:h:qualcomm:sd415:-
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cpe:2.3:h:qualcomm:sd430:-
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cpe:2.3:h:qualcomm:sd450:-
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cpe:2.3:h:qualcomm:sd615:-
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cpe:2.3:h:qualcomm:sd616:-
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cpe:2.3:h:qualcomm:sd617:-
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cpe:2.3:h:qualcomm:sd625:-
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cpe:2.3:h:qualcomm:sd650:-
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cpe:2.3:h:qualcomm:sd652:-
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cpe:2.3:h:qualcomm:sd810:-
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cpe:2.3:h:qualcomm:sd820:-
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cpe:2.3:h:qualcomm:sd820a:-
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cpe:2.3:h:qualcomm:sd835:-
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cpe:2.3:h:qualcomm:sd845:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:o:qualcomm:msm8909w_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:sd205_firmware:-
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cpe:2.3:o:qualcomm:sd210_firmware:-
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cpe:2.3:o:qualcomm:sd212_firmware:-
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cpe:2.3:o:qualcomm:sd415_firmware:-
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cpe:2.3:o:qualcomm:sd430_firmware:-
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cpe:2.3:o:qualcomm:sd450_firmware:-
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cpe:2.3:o:qualcomm:sd615_firmware:-
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cpe:2.3:o:qualcomm:sd616_firmware:-
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cpe:2.3:o:qualcomm:sd617_firmware:-
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cpe:2.3:o:qualcomm:sd625_firmware:-
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cpe:2.3:o:qualcomm:sd650_firmware:-
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cpe:2.3:o:qualcomm:sd652_firmware:-
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cpe:2.3:o:qualcomm:sd810_firmware:-
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cpe:2.3:o:qualcomm:sd820_firmware:-
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cpe:2.3:o:qualcomm:sd820a_firmware:-
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cpe:2.3:o:qualcomm:sd835_firmware:-
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cpe:2.3:o:qualcomm:sd845_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-