Vulnerability Details CVE-2018-11267
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 10.6%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
Products affected by CVE-2018-11267
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9615:-
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cpe:2.3:h:qualcomm:mdm9640:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:mdm9655:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:sd205:-
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cpe:2.3:h:qualcomm:sd210:-
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cpe:2.3:h:qualcomm:sd212:-
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cpe:2.3:h:qualcomm:sd410:-
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cpe:2.3:h:qualcomm:sd412:-
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cpe:2.3:h:qualcomm:sd415:-
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cpe:2.3:h:qualcomm:sd425:-
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cpe:2.3:h:qualcomm:sd427:-
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cpe:2.3:h:qualcomm:sd430:-
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cpe:2.3:h:qualcomm:sd435:-
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cpe:2.3:h:qualcomm:sd450:-
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cpe:2.3:h:qualcomm:sd600:-
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cpe:2.3:h:qualcomm:sd615:-
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cpe:2.3:h:qualcomm:sd616:-
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cpe:2.3:h:qualcomm:sd617:-
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cpe:2.3:h:qualcomm:sd625:-
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cpe:2.3:h:qualcomm:sd650:-
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cpe:2.3:h:qualcomm:sd652:-
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cpe:2.3:h:qualcomm:sd820:-
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cpe:2.3:h:qualcomm:sd820a:-
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cpe:2.3:h:qualcomm:sd835:-
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cpe:2.3:h:qualcomm:sd845:-
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cpe:2.3:h:qualcomm:sd850:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm429:-
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cpe:2.3:h:qualcomm:sdm439:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm632:-
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cpe:2.3:h:qualcomm:sdm636:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sdx20:-
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cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9615_firmware:-
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cpe:2.3:o:qualcomm:mdm9640_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:mdm9655_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:sd205_firmware:-
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cpe:2.3:o:qualcomm:sd210_firmware:-
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cpe:2.3:o:qualcomm:sd212_firmware:-
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cpe:2.3:o:qualcomm:sd410_firmware:-
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cpe:2.3:o:qualcomm:sd412_firmware:-
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cpe:2.3:o:qualcomm:sd415_firmware:-
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cpe:2.3:o:qualcomm:sd425_firmware:-
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cpe:2.3:o:qualcomm:sd427_firmware:-
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cpe:2.3:o:qualcomm:sd430_firmware:-
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cpe:2.3:o:qualcomm:sd435_firmware:-
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cpe:2.3:o:qualcomm:sd450_firmware:-
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cpe:2.3:o:qualcomm:sd600_firmware:-
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cpe:2.3:o:qualcomm:sd615_firmware:-
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cpe:2.3:o:qualcomm:sd616_firmware:-
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cpe:2.3:o:qualcomm:sd617_firmware:-
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cpe:2.3:o:qualcomm:sd625_firmware:-
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cpe:2.3:o:qualcomm:sd650_firmware:-
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cpe:2.3:o:qualcomm:sd652_firmware:-
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cpe:2.3:o:qualcomm:sd820_firmware:-
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cpe:2.3:o:qualcomm:sd820a_firmware:-
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cpe:2.3:o:qualcomm:sd835_firmware:-
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cpe:2.3:o:qualcomm:sd845_firmware:-
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cpe:2.3:o:qualcomm:sd850_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm429_firmware:-
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cpe:2.3:o:qualcomm:sdm439_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm632_firmware:-
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cpe:2.3:o:qualcomm:sdm636_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sdx20_firmware:-
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cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-