Vulnerability Details CVE-2018-11258
In ADSP RPC in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, a Use After Free condition can occur in versions MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 15.7%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 4.6
References
Products affected by CVE-2018-11258
-
cpe:2.3:h:qualcomm:mdm9206:-
-
cpe:2.3:h:qualcomm:mdm9607:-
-
cpe:2.3:h:qualcomm:mdm9650:-
-
cpe:2.3:h:qualcomm:msm8909w:-
-
cpe:2.3:h:qualcomm:msm8996au:-
-
cpe:2.3:h:qualcomm:sd_205:-
-
cpe:2.3:h:qualcomm:sd_210:-
-
cpe:2.3:h:qualcomm:sd_212:-
-
cpe:2.3:h:qualcomm:sd_415:-
-
cpe:2.3:h:qualcomm:sd_425:-
-
cpe:2.3:h:qualcomm:sd_450:-
-
cpe:2.3:h:qualcomm:sd_615:-
-
cpe:2.3:h:qualcomm:sd_616:-
-
cpe:2.3:h:qualcomm:sd_625:-
-
cpe:2.3:h:qualcomm:sd_650:-
-
cpe:2.3:h:qualcomm:sd_652:-
-
cpe:2.3:h:qualcomm:sd_820:-
-
cpe:2.3:h:qualcomm:sd_820a:-
-
cpe:2.3:h:qualcomm:sd_835:-
-
cpe:2.3:h:qualcomm:sd_845:-
-
cpe:2.3:h:qualcomm:sdx20:-
-
cpe:2.3:o:qualcomm:mdm9206_firmware:-
-
cpe:2.3:o:qualcomm:mdm9607_firmware:-
-
cpe:2.3:o:qualcomm:mdm9650_firmware:-
-
cpe:2.3:o:qualcomm:msm8909w_firmware:-
-
cpe:2.3:o:qualcomm:msm8996au_firmware:-
-
cpe:2.3:o:qualcomm:sd_205_firmware:-
-
cpe:2.3:o:qualcomm:sd_210_firmware:-
-
cpe:2.3:o:qualcomm:sd_212_firmware:-
-
cpe:2.3:o:qualcomm:sd_415_firmware:-
-
cpe:2.3:o:qualcomm:sd_425_firmware:-
-
cpe:2.3:o:qualcomm:sd_450_firmware:-
-
cpe:2.3:o:qualcomm:sd_615_firmware:-
-
cpe:2.3:o:qualcomm:sd_616_firmware:-
-
cpe:2.3:o:qualcomm:sd_625_firmware:-
-
cpe:2.3:o:qualcomm:sd_650_firmware:-
-
cpe:2.3:o:qualcomm:sd_652_firmware:-
-
cpe:2.3:o:qualcomm:sd_820_firmware:-
-
cpe:2.3:o:qualcomm:sd_820a_firmware:-
-
cpe:2.3:o:qualcomm:sd_835_firmware:-
-
cpe:2.3:o:qualcomm:sd_845_firmware:-
-
cpe:2.3:o:qualcomm:sdx20_firmware:-