Vulnerability Details CVE-2017-18330
Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 4.6%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
Products affected by CVE-2017-18330
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cpe:2.3:h:qualcomm:ipq8074:-
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cpe:2.3:h:qualcomm:mdm9206:-
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cpe:2.3:h:qualcomm:mdm9607:-
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cpe:2.3:h:qualcomm:mdm9635m:-
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cpe:2.3:h:qualcomm:mdm9640:-
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cpe:2.3:h:qualcomm:mdm9650:-
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cpe:2.3:h:qualcomm:mdm9655:-
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cpe:2.3:h:qualcomm:msm8909w:-
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:sd_205:-
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cpe:2.3:h:qualcomm:sd_210:-
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cpe:2.3:h:qualcomm:sd_212:-
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cpe:2.3:h:qualcomm:sd_410:-
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cpe:2.3:h:qualcomm:sd_412:-
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cpe:2.3:h:qualcomm:sd_415:-
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cpe:2.3:h:qualcomm:sd_425:-
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cpe:2.3:h:qualcomm:sd_427:-
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cpe:2.3:h:qualcomm:sd_429:-
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cpe:2.3:h:qualcomm:sd_430:-
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cpe:2.3:h:qualcomm:sd_435:-
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cpe:2.3:h:qualcomm:sd_439:-
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cpe:2.3:h:qualcomm:sd_450:-
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cpe:2.3:h:qualcomm:sd_615:-
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cpe:2.3:h:qualcomm:sd_616:-
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cpe:2.3:h:qualcomm:sd_625:-
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cpe:2.3:h:qualcomm:sd_632:-
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cpe:2.3:h:qualcomm:sd_636:-
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cpe:2.3:h:qualcomm:sd_650:-
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cpe:2.3:h:qualcomm:sd_652:-
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cpe:2.3:h:qualcomm:sd_810:-
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cpe:2.3:h:qualcomm:sd_820:-
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cpe:2.3:h:qualcomm:sd_820a:-
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cpe:2.3:h:qualcomm:sd_835:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm439:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:h:qualcomm:sdx24:-
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cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-
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cpe:2.3:o:qualcomm:ipq8074_firmware:-
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cpe:2.3:o:qualcomm:mdm9206_firmware:-
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cpe:2.3:o:qualcomm:mdm9607_firmware:-
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cpe:2.3:o:qualcomm:mdm9635m_firmware:-
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cpe:2.3:o:qualcomm:mdm9640_firmware:-
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cpe:2.3:o:qualcomm:mdm9650_firmware:-
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cpe:2.3:o:qualcomm:mdm9655_firmware:-
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cpe:2.3:o:qualcomm:msm8909w_firmware:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:sd_205_firmware:-
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cpe:2.3:o:qualcomm:sd_210_firmware:-
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cpe:2.3:o:qualcomm:sd_212_firmware:-
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cpe:2.3:o:qualcomm:sd_410_firmware:-
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cpe:2.3:o:qualcomm:sd_412_firmware:-
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cpe:2.3:o:qualcomm:sd_415_firmware:-
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cpe:2.3:o:qualcomm:sd_425_firmware:-
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cpe:2.3:o:qualcomm:sd_427_firmware:-
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cpe:2.3:o:qualcomm:sd_429_firmware:-
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cpe:2.3:o:qualcomm:sd_430_firmware:-
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cpe:2.3:o:qualcomm:sd_435_firmware:-
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cpe:2.3:o:qualcomm:sd_439_firmware:-
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cpe:2.3:o:qualcomm:sd_450_firmware:-
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cpe:2.3:o:qualcomm:sd_615_firmware:-
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cpe:2.3:o:qualcomm:sd_616_firmware:-
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cpe:2.3:o:qualcomm:sd_625_firmware:-
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cpe:2.3:o:qualcomm:sd_632_firmware:-
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cpe:2.3:o:qualcomm:sd_636_firmware:-
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cpe:2.3:o:qualcomm:sd_650_firmware:-
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cpe:2.3:o:qualcomm:sd_652_firmware:-
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cpe:2.3:o:qualcomm:sd_810_firmware:-
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cpe:2.3:o:qualcomm:sd_820_firmware:-
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cpe:2.3:o:qualcomm:sd_820a_firmware:-
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cpe:2.3:o:qualcomm:sd_835_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm439_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-
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cpe:2.3:o:qualcomm:sdx24_firmware:-
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cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-