Vulnerability Details CVE-2017-18313
Under certain mode of operations, HLOS may be able get direct or indirect access through DXE channels to tamper with the authenticated WCNSS firmware stored in DDR because DXE-accessible memory is located within the authenticated image in Snapdragon Mobile and Snapdragon Wear in version MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 615/16/SD 415, SD 617.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 22.9%
CVSS Severity
CVSS v3 Score 5.3
CVSS v2 Score 5.7
References
Products affected by CVE-2017-18313
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cpe:2.3:h:qualcomm:msm8909w:-
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cpe:2.3:h:qualcomm:sd_205:-
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cpe:2.3:h:qualcomm:sd_210:-
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cpe:2.3:h:qualcomm:sd_212:-
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cpe:2.3:h:qualcomm:sd_410:-
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cpe:2.3:h:qualcomm:sd_412:-
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cpe:2.3:h:qualcomm:sd_415:-
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cpe:2.3:h:qualcomm:sd_615:-
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cpe:2.3:h:qualcomm:sd_616:-
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cpe:2.3:h:qualcomm:sd_617:-
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cpe:2.3:o:qualcomm:msm8909w_firmware:-
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cpe:2.3:o:qualcomm:sd_205_firmware:-
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cpe:2.3:o:qualcomm:sd_210_firmware:-
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cpe:2.3:o:qualcomm:sd_212_firmware:-
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cpe:2.3:o:qualcomm:sd_410_firmware:-
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cpe:2.3:o:qualcomm:sd_412_firmware:-
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cpe:2.3:o:qualcomm:sd_415_firmware:-
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cpe:2.3:o:qualcomm:sd_615_firmware:-
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cpe:2.3:o:qualcomm:sd_616_firmware:-
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cpe:2.3:o:qualcomm:sd_617_firmware:-