Vulnerability Details CVE-2017-18302
In Snapdragon (Automobile ,Mobile) in version MSM8996AU, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, a crafted HLOS client can modify the structure in memory passed to a QSEE application between the time of check and the time of use, resulting in arbitrary writes to TZ kernel memory regions.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 15.4%
CVSS Severity
CVSS v3 Score 4.7
CVSS v2 Score 4.7
Products affected by CVE-2017-18302
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cpe:2.3:h:qualcomm:msm8996au:-
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cpe:2.3:h:qualcomm:sd425:-
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cpe:2.3:h:qualcomm:sd427:-
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cpe:2.3:h:qualcomm:sd430:-
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cpe:2.3:h:qualcomm:sd435:-
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cpe:2.3:h:qualcomm:sd450:-
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cpe:2.3:h:qualcomm:sd625:-
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cpe:2.3:h:qualcomm:sd650:-
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cpe:2.3:h:qualcomm:sd652:-
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cpe:2.3:h:qualcomm:sd820:-
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cpe:2.3:h:qualcomm:sd820a:-
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cpe:2.3:h:qualcomm:sd835:-
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cpe:2.3:h:qualcomm:sda660:-
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cpe:2.3:h:qualcomm:sdm429:-
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cpe:2.3:h:qualcomm:sdm439:-
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cpe:2.3:h:qualcomm:sdm630:-
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cpe:2.3:h:qualcomm:sdm632:-
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cpe:2.3:h:qualcomm:sdm636:-
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cpe:2.3:h:qualcomm:sdm660:-
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cpe:2.3:o:qualcomm:msm8996au_firmware:-
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cpe:2.3:o:qualcomm:sd425_firmware:-
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cpe:2.3:o:qualcomm:sd427_firmware:-
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cpe:2.3:o:qualcomm:sd430_firmware:-
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cpe:2.3:o:qualcomm:sd435_firmware:-
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cpe:2.3:o:qualcomm:sd450_firmware:-
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cpe:2.3:o:qualcomm:sd625_firmware:-
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cpe:2.3:o:qualcomm:sd650_firmware:-
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cpe:2.3:o:qualcomm:sd652_firmware:-
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cpe:2.3:o:qualcomm:sd820_firmware:-
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cpe:2.3:o:qualcomm:sd820a_firmware:-
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cpe:2.3:o:qualcomm:sd835_firmware:-
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cpe:2.3:o:qualcomm:sda660_firmware:-
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cpe:2.3:o:qualcomm:sdm429_firmware:-
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cpe:2.3:o:qualcomm:sdm439_firmware:-
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cpe:2.3:o:qualcomm:sdm630_firmware:-
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cpe:2.3:o:qualcomm:sdm632_firmware:-
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cpe:2.3:o:qualcomm:sdm636_firmware:-
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cpe:2.3:o:qualcomm:sdm660_firmware:-