Vulnerability Details CVE-2017-18297
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 16.9%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
- http://www.securitytracker.com/id/1041432
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
- https://www.qualcomm.com/company/product-security/bulletins
- http://www.securitytracker.com/id/1041432
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components
- https://www.qualcomm.com/company/product-security/bulletins
Products affected by CVE-2017-18297
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cpe:2.3:h:qualcomm:sd_425:-
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cpe:2.3:h:qualcomm:sd_430:-
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cpe:2.3:h:qualcomm:sd_450:-
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cpe:2.3:h:qualcomm:sd_625:-
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cpe:2.3:h:qualcomm:sd_650:-
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cpe:2.3:h:qualcomm:sd_652:-
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cpe:2.3:h:qualcomm:sd_820:-
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cpe:2.3:o:qualcomm:sd_425_firmware:-
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cpe:2.3:o:qualcomm:sd_430_firmware:-
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cpe:2.3:o:qualcomm:sd_450_firmware:-
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cpe:2.3:o:qualcomm:sd_625_firmware:-
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cpe:2.3:o:qualcomm:sd_650_firmware:-
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cpe:2.3:o:qualcomm:sd_652_firmware:-
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cpe:2.3:o:qualcomm:sd_820_firmware:-