Vulnerability Details CVE-2017-18274
While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 8.8%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2017-18274
-
cpe:2.3:h:qualcomm:mdm9206:-
-
cpe:2.3:h:qualcomm:mdm9607:-
-
cpe:2.3:h:qualcomm:mdm9650:-
-
cpe:2.3:h:qualcomm:sd_205:-
-
cpe:2.3:h:qualcomm:sd_210:-
-
cpe:2.3:h:qualcomm:sd_212:-
-
cpe:2.3:h:qualcomm:sd_425:-
-
cpe:2.3:h:qualcomm:sd_430:-
-
cpe:2.3:h:qualcomm:sd_450:-
-
cpe:2.3:h:qualcomm:sd_617:-
-
cpe:2.3:h:qualcomm:sd_625:-
-
cpe:2.3:h:qualcomm:sd_650:-
-
cpe:2.3:h:qualcomm:sd_652:-
-
cpe:2.3:h:qualcomm:sd_820:-
-
cpe:2.3:h:qualcomm:sd_820a:-
-
cpe:2.3:h:qualcomm:sd_835:-
-
cpe:2.3:o:qualcomm:mdm9206_firmware:-
-
cpe:2.3:o:qualcomm:mdm9607_firmware:-
-
cpe:2.3:o:qualcomm:mdm9650_firmware:-
-
cpe:2.3:o:qualcomm:sd_205_firmware:-
-
cpe:2.3:o:qualcomm:sd_210_firmware:-
-
cpe:2.3:o:qualcomm:sd_212_firmware:-
-
cpe:2.3:o:qualcomm:sd_425_firmware:-
-
cpe:2.3:o:qualcomm:sd_430_firmware:-
-
cpe:2.3:o:qualcomm:sd_450_firmware:-
-
cpe:2.3:o:qualcomm:sd_617_firmware:-
-
cpe:2.3:o:qualcomm:sd_625_firmware:-
-
cpe:2.3:o:qualcomm:sd_650_firmware:-
-
cpe:2.3:o:qualcomm:sd_652_firmware:-
-
cpe:2.3:o:qualcomm:sd_820_firmware:-
-
cpe:2.3:o:qualcomm:sd_820a_firmware:-
-
cpe:2.3:o:qualcomm:sd_835_firmware:-