Vulnerability Details CVE-2017-18173
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.0
EPSS Ranking 8.1%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 7.2
References
Products affected by CVE-2017-18173
-
cpe:2.3:h:qualcomm:sd_425:-
-
cpe:2.3:h:qualcomm:sd_427:-
-
cpe:2.3:h:qualcomm:sd_430:-
-
cpe:2.3:h:qualcomm:sd_435:-
-
cpe:2.3:h:qualcomm:sd_450:-
-
cpe:2.3:h:qualcomm:sd_625:-
-
cpe:2.3:h:qualcomm:sd_810:-
-
cpe:2.3:h:qualcomm:sd_820:-
-
cpe:2.3:h:qualcomm:sd_835:-
-
cpe:2.3:h:qualcomm:sdm630:-
-
cpe:2.3:h:qualcomm:sdm636:-
-
cpe:2.3:h:qualcomm:sdm660:-
-
cpe:2.3:h:qualcomm:snapdragon_high_med_2016:-
-
cpe:2.3:o:qualcomm:sd_425_firmware:-
-
cpe:2.3:o:qualcomm:sd_427_firmware:-
-
cpe:2.3:o:qualcomm:sd_430_firmware:-
-
cpe:2.3:o:qualcomm:sd_435_firmware:-
-
cpe:2.3:o:qualcomm:sd_450_firmware:-
-
cpe:2.3:o:qualcomm:sd_625_firmware:-
-
cpe:2.3:o:qualcomm:sd_810_firmware:-
-
cpe:2.3:o:qualcomm:sd_820_firmware:-
-
cpe:2.3:o:qualcomm:sd_835_firmware:-
-
cpe:2.3:o:qualcomm:sdm630_firmware:-
-
cpe:2.3:o:qualcomm:sdm636_firmware:-
-
cpe:2.3:o:qualcomm:sdm660_firmware:-
-
cpe:2.3:o:qualcomm:snapdragon_high_med_2016_firmware:-