Vulnerabilities
Vulnerable Software

Vulnerability Details CVE-2016-2063

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Exploit prediction scoring system (EPSS) score
EPSS Score 0.001
EPSS Ranking 33.1%
CVSS Severity
CVSS v3 Score 7.8
CVSS v2 Score 4.6
Products affected by CVE-2016-2063


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